Invention Grant
- Patent Title: Printed circuit board and method for manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
-
Application No.: US14849122Application Date: 2015-09-09
-
Publication No.: US09526169B2Publication Date: 2016-12-20
- Inventor: Hyung Gi Ha , Jae Won Jung , Yong Hwan Kim , Jong Jin Lee , Ja Ho Koo , Young Hwan Shin , Dong Kyu Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2010-0138241 20101229
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H05K1/02 ; H05K3/38 ; H05K3/46

Abstract:
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a granular structure formed on the first surface roughness.
Public/Granted literature
- US20150382461A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2015-12-31
Information query