Invention Grant
US09526177B2 Printed circuit board including electronic component embedded therein and method for manufacturing the same 有权
包含嵌入其中的电子部件的印刷电路板及其制造方法

Printed circuit board including electronic component embedded therein and method for manufacturing the same
Abstract:
Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers.
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