Invention Grant
- Patent Title: Printed circuit board including electronic component embedded therein and method for manufacturing the same
- Patent Title (中): 包含嵌入其中的电子部件的印刷电路板及其制造方法
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Application No.: US14061047Application Date: 2013-10-23
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Publication No.: US09526177B2Publication Date: 2016-12-20
- Inventor: Seung Eun Lee , Yul Kyo Chung , Yee Na Shin , Doo Hwan Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2013-0046733 20130426
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/18 ; H01L23/00 ; H05K3/46 ; H01L21/56

Abstract:
Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers.
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