Invention Grant
- Patent Title: Reducing dielectric loss in solder masks
- Patent Title (中): 降低焊料掩模中的介电损耗
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Application No.: US13995667Application Date: 2011-12-09
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Publication No.: US09526180B2Publication Date: 2016-12-20
- Inventor: Dennis J. Miller
- Applicant: Dennis J. Miller
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jordan IP Law, LLC
- International Application: PCT/US2011/064196 WO 20111209
- International Announcement: WO2013/085542 WO 20130613
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/00 ; H05K3/28 ; B01F3/12
Abstract:
A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.
Public/Granted literature
- US20140345923A1 REDUCING DIELECTRIC LOSS IN SOLDER MASKS Public/Granted day:2014-11-27
Information query
