Invention Grant
- Patent Title: Electrowetting device with multi layer support plate
- Patent Title (中): 带多层支撑板的电动搅拌装置
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Application No.: US14667896Application Date: 2015-03-25
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Publication No.: US09529188B2Publication Date: 2016-12-27
- Inventor: Cristina Maria Petcu , Gerben Boon
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: EIP US LLP
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B1/04 ; G02B1/06

Abstract:
An electrowetting element comprising a first fluid and a second fluid immiscible with the first fluid. A support plate includes an electrode for applying a voltage to control a configuration of the first and second fluids and a plurality of layers between the electrode and at least one of the first or second fluids. The plurality of layers includes a first layer comprising a first plurality of pinholes and a second layer comprising fewer pinholes than the first layer. The first layer is disposed on the second layer, between the second layer and at least one of the first or second fluids.
Public/Granted literature
- US20160282605A1 ELECTROWETTING DEVICE WITH MULTI LAYER SUPPORT PLATE Public/Granted day:2016-09-29
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