Invention Grant
- Patent Title: Suspension assembly, head suspension assembly and disk device with the same
- Patent Title (中): 悬挂组件,头悬挂组件和磁盘设备相同
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Application No.: US14741649Application Date: 2015-06-17
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Publication No.: US09530441B2Publication Date: 2016-12-27
- Inventor: Takafumi Kikuchi , Kenichiro Aoki
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Priority: JP2015-049807 20150312
- Main IPC: H05K1/05
- IPC: H05K1/05 ; G11B5/48 ; H05K1/18

Abstract:
According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.
Public/Granted literature
- US20160267927A1 SUSPENSION ASSEMBLY, HEAD SUSPENSION ASSEMBLY AND DISK DEVICE WITH THE SAME Public/Granted day:2016-09-15
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