Invention Grant
- Patent Title: Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera
- Patent Title (中): 制造接合基板，接合基板，固态成像装置的制造方法，固态成像装置和相机的方法
-
Application No.: US14147003Application Date: 2014-01-03
-
Publication No.: US09530687B2Publication Date: 2016-12-27
- Inventor: Nobutoshi Fujii
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2009-272491 20091130
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L27/146 ; H01L31/18
Abstract:
Disclosed herein is a method of manufacturing a bonded substrate, including the steps of: forming a first bonding layer on a surface on one side of a semiconductor substrate; forming a second bonding layer on a surface on one side of a support substrate; adhering the first bonding layer and the second bonding layer to each other; a heat treatment for bonding the first bonding layer and the second bonding layer to each other; and thinning the semiconductor substrate from a surface on the other side of the semiconductor substrate to form a semiconductor layer.
Public/Granted literature
Information query
IPC分类:
