Invention Grant
- Patent Title: Method of clamping a semiconductor assembly
- Patent Title (中): 夹紧半导体组件的方法
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Application No.: US13416429Application Date: 2012-03-09
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Publication No.: US09530750B2Publication Date: 2016-12-27
- Inventor: Oleg S. Fishman , Satyen N. Prabhu
- Applicant: Oleg S. Fishman , Satyen N. Prabhu
- Applicant Address: US NJ Rancocas
- Assignee: INDUCTOTHERM CORP.
- Current Assignee: INDUCTOTHERM CORP.
- Current Assignee Address: US NJ Rancocas
- Agent Philip O. Post
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L23/00
Abstract:
The present invention relates to a method of clamping a semiconductor assembly with a desired compression force equally distributed across the opposing surfaces of the devices and associated components of the semiconductor assembly.
Public/Granted literature
- US20120192392A1 Compression Clamping of Semiconductor Components Public/Granted day:2012-08-02
Information query
