Invention Grant
- Patent Title: Semiconductor package, semiconductor device and method of forming the same
- Patent Title (中): 半导体封装，半导体器件及其形成方法
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Application No.: US14152168Application Date: 2014-01-10
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Publication No.: US09530762B2Publication Date: 2016-12-27
- Inventor: Chen-Hua Yu , Chung-Shi Liu , Chih-Fan Huang , Tsai-Tsung Tsai , Wei-Hung Lin , Ming-Da Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L25/18 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
According to an exemplary embodiment, a semiconductor package is provided. The A semiconductor package includes at least one chip, and at least one component adjacent to the at least one chip, wherein the at least one chip and the at least one component are molded in a same molding body.
Public/Granted literature
- US20150200188A1 SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2015-07-16
Information query
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