Invention Grant
- Patent Title: Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
- Patent Title (中): 电子设备，组装和制造包括垂直沟槽电容器和垂直互连的电子设备的方法
-
Application No.: US10560717Application Date: 2004-06-11
-
Publication No.: US09530857B2Publication Date: 2016-12-27
- Inventor: Freddy Roozeboom , Adrianus Alphonsus Jozef Buijsman , Patrice Gamand , Antonius Lucien Adrianus Maria Kemmeren , Gerardus Tarcisius Maria Hubert
- Applicant: Freddy Roozeboom , Adrianus Alphonsus Jozef Buijsman , Patrice Gamand , Antonius Lucien Adrianus Maria Kemmeren , Gerardus Tarcisius Maria Hubert
- Applicant Address: US CA San Jose
- Assignee: Tessera Advanced Technologies, Inc.
- Current Assignee: Tessera Advanced Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Priority: EP03300035 20030620; EP04300132 20040310
- International Application: PCT/IB2004/050887 WO 20040611
- International Announcement: WO2004/114397 WO 20041229
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/053 ; H01L29/66 ; H01L21/768 ; H01L23/48 ; H01L27/08 ; H01L29/06
Abstract:
A semiconductor substrate comprises both vertical interconnects and vertical capacitors with a common dielectric layer. The substrate can be suitably combined with further devices to form an assembly. The substrate can be made in etching treatments including a first step on the one side, and then a second step on the other side of the substrate.
Public/Granted literature
- US20060131691A1 Electronic device, assembly and methods of manufacturing an electronic device Public/Granted day:2006-06-22
Information query
IPC分类:
