Invention Grant
- Patent Title: Microstructure enhanced absorption photosensitive devices
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Application No.: US14943898Application Date: 2015-11-17
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Publication No.: US09530905B2Publication Date: 2016-12-27
- Inventor: Shih-Yuan Wang , Shih-Ping Wang
- Applicant: W&WSENS DEVICES, INC.
- Applicant Address: US CA Los Altos
- Assignee: W&WSENS DEVICES, INC.
- Current Assignee: W&WSENS DEVICES, INC.
- Current Assignee Address: US CA Los Altos
- Agency: Cooper & Dunham LLP
- Main IPC: H01L31/0236
- IPC: H01L31/0236 ; H01L27/144 ; H01L27/146 ; H04B10/69 ; H01L31/02 ; H01L31/0232 ; H01L31/09 ; H01L31/103 ; H01L31/028 ; H01L31/107 ; H04B10/25 ; H04B10/40 ; H04B10/80

Abstract:
Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as holes, effectively increase the absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more. Their thickness dimensions allow them to be conveniently integrated on the same Si chip with CMOS, BiCMOS, and other electronics, with resulting packaging benefits and reduced capacitance and thus higher speeds.
Public/Granted literature
- US20160307939A1 MICROSTRUCTURE ENHANCED ABSORPTION PHOTOSENSITIVE DEVICES Public/Granted day:2016-10-20
Information query
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