Invention Grant
- Patent Title: Bone conduction speaker unit
- Patent Title (中): 骨传导扬声器单元
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Application No.: US14773873Application Date: 2015-01-27
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Publication No.: US09532123B2Publication Date: 2016-12-27
- Inventor: Mikio Fukuda
- Applicant: TEMCO JAPAN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TEMCO JAPAN CO., LTD.
- Current Assignee: TEMCO JAPAN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Browdy and Neimark, PLLC
- Priority: JP2014-030991 20140220
- International Application: PCT/JP2015/052113 WO 20150127
- International Announcement: WO2015/125566 WO 20150827
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/02 ; B06B1/04 ; H04M1/03

Abstract:
Provided is a bone conduction speaker unit which can sufficiently prevent generation of sound leakage at non-calling. The bone conduction speaker unit includes a bone conduction speaker main body, being incorporated in a housing with an elastic base being interposed, an elastic cover being mounted on a top face of the housing. Bonding between a rear face of the bone conduction speaker main body and a top face of the elastic base, and/or bonding between the elastic base and an inner bottom face of the housing are partially made; upon the elastic cover having been mounted on the housing, a gap is held between an internal top face of the elastic cover and a top face of the bone conduction speaker main body; and with the elastic cover being pressed in use, the internal top face thereof is abutted against the top face of the bone conduction speaker main body.
Public/Granted literature
- US20160044395A1 BONE CONDUCTION SPEAKER UNIT Public/Granted day:2016-02-11
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