Invention Grant
- Patent Title: Surface treating composition for copper and copper alloy and utilization thereof
- Patent Title (中): 铜和铜合金表面处理组合物及其应用
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Application No.: US14119304Application Date: 2012-05-23
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Publication No.: US09532493B2Publication Date: 2016-12-27
- Inventor: Hirohiko Hirao , Noriaki Yamaji , Masato Nakanishi , Takayuki Murai
- Applicant: Hirohiko Hirao , Noriaki Yamaji , Masato Nakanishi , Takayuki Murai
- Applicant Address: JP Kagawa
- Assignee: SHIKOKU CHEMICALS CORPORATION
- Current Assignee: SHIKOKU CHEMICALS CORPORATION
- Current Assignee Address: JP Kagawa
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2011-114289 20110523
- International Application: PCT/JP2012/063826 WO 20120523
- International Announcement: WO2012/161341 WO 20121129
- Main IPC: C23C22/52
- IPC: C23C22/52 ; C23C22/63 ; C23C22/48 ; H05K13/00 ; B23K35/365 ; C07D233/56 ; C07D235/08 ; C07D409/04 ; C07D409/06 ; C23F11/14 ; C23F11/16 ; H05K3/28 ; H05K1/09 ; C23C22/00

Abstract:
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
Public/Granted literature
- US20140097231A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF Public/Granted day:2014-04-10
Information query
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