Invention Grant
- Patent Title: Temperature sensing apparatus, laser processing system, and temperature measuring method
- Patent Title (中): 温度传感装置,激光加工系统和温度测量方法
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Application No.: US14504433Application Date: 2014-10-02
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Publication No.: US09533375B2Publication Date: 2017-01-03
- Inventor: Chia-Hung Cho , Yi-Chen Hsieh , Kai-Ping Chuang , Sen-Yih Chou , Chun-Jen Lin
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: B23K26/34
- IPC: B23K26/34 ; B23K26/067 ; B23K26/30 ; B23K26/03 ; G01J5/08 ; B29C67/00 ; B22F3/105

Abstract:
A temperature sensing apparatus configured to measure a temperature distribution of a surface to be measured is provided. The temperature sensing apparatus includes a lens set, a filtering module, a plurality of sensor arrays, and a processing unit. The lens set is configured to receive radiation from the surface to be measured. The filtering module is configured to filter the radiation from the lens set into a plurality of radiation portions respectively having different wavelengths. The sensor arrays are configured to respectively sense the radiation portions. The processing unit is configured to calculate an intensity ratio distribution of the radiation between the different wavelengths according to the radiation portions respectively sensed by the sensor arrays and determine the temperature distribution according to the intensity ratio distribution. A laser processing system and a temperature measuring method are also provided.
Public/Granted literature
- US20160096236A1 TEMPERATURE SENSING APPARATUS, LASER PROCESSING SYSTEM, AND TEMPERATURE MEASURING METHOD Public/Granted day:2016-04-07
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