Invention Grant
- Patent Title: Positive relief forming of polycrystalline diamond structures and resulting cutting tools
- Patent Title (中): 多晶金刚石结构和所得切削工具的正浮雕形成
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Application No.: US14463587Application Date: 2014-08-19
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Publication No.: US09533398B2Publication Date: 2017-01-03
- Inventor: David P. Miess
- Applicant: US SYNTHETIC CORPORATION
- Applicant Address: US UT Orem
- Assignee: US SYNTHETIC CORPORATION
- Current Assignee: US SYNTHETIC CORPORATION
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- Main IPC: B24D3/00
- IPC: B24D3/00 ; B24D3/02 ; B24D11/00 ; B24D18/00 ; C09K3/14
Abstract:
Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
Public/Granted literature
- US20160052108A1 POSITIVE RELIEF FORMING OF POLYCRYSTALLINE DIAMOND STRUCTURES AND RESULTING CUTTING TOOLS Public/Granted day:2016-02-25
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