Invention Grant
- Patent Title: Puncture repair device
- Patent Title (中): 穿刺修复装置
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Application No.: US14654431Application Date: 2013-11-28
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Publication No.: US09533455B2Publication Date: 2017-01-03
- Inventor: Hideyuki Takahara
- Applicant: The Yokohama Rubber Co., LTD.
- Applicant Address: JP
- Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee Address: JP
- Agency: Thorpe North & Western
- Priority: JP2012-278470 20121220
- International Application: PCT/JP2013/082059 WO 20131128
- International Announcement: WO2014/097848 WO 20140626
- Main IPC: B29C73/02
- IPC: B29C73/02 ; B29C73/24 ; B29C73/16 ; B60C29/06
Abstract:
A puncture repair device of the present technology is provided with: a compressor; a vessel to which the compressed air from the compressor is supplied and that contains a puncture repair liquid that is pumped into the cavity of a tire; and a heating device that heats the puncture repair liquid.
Public/Granted literature
- US20150343723A1 Puncture Repair Device Public/Granted day:2015-12-03
Information query
