The present invention relates to a blister package consisting of a lower web in which a row of cavities is provided, and an upper web which is welded to the provided lower web, and wherein perforation lines are provided between adjoining cavities, and wherein there is an area in connection with each cavity where the upper web is not welded to the lower web, such that a snip is created, said upper web being welded to the lower web by a first inner weld which surrounds the cavity completely, as well as a second outer weld which surrounds the cavity around the first weld and adjoins the area where the upper web is not welded to the lower web. The invention also relates to a method of making the blister package.