Invention Grant
- Patent Title: MEMS structures and methods for forming the same
- Patent Title (中): MEMS结构及其形成方法
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Application No.: US14731823Application Date: 2015-06-05
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Publication No.: US09533876B2Publication Date: 2017-01-03
- Inventor: Ping-Yin Liu , Xin-Hua Huang , Hsin-Ting Huang , Yuan-Chih Hsieh , Jung-Huei Peng , Lan-Lin Chao , Chia-Shiung Tsai , Chun-Wen Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; H01L49/02 ; B81C1/00 ; H01G5/16 ; B81B3/00
Abstract:
A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer.
Public/Granted literature
- US20150266722A1 MEMS Structures and Methods for Forming the Same Public/Granted day:2015-09-24
Information query
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