Invention Grant
- Patent Title: Molding material and molding
- Patent Title (中): 成型材料和成型
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Application No.: US14123158Application Date: 2012-05-30
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Publication No.: US09534065B2Publication Date: 2017-01-03
- Inventor: Fuminori Nakaya , Tetsuya Noda , Keiichi Sakashita , Hiroyuki Nogami , Takafumi Asai
- Applicant: Fuminori Nakaya , Tetsuya Noda , Keiichi Sakashita , Hiroyuki Nogami , Takafumi Asai
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI RAYON CO., LTD.
- Current Assignee: MITSUBISHI RAYON CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-120449 20110530
- International Application: PCT/JP2012/063936 WO 20120530
- International Announcement: WO2012/165482 WO 20121206
- Main IPC: C08F26/06
- IPC: C08F26/06 ; B29C45/00 ; C08F220/14 ; C08J5/18 ; C08F2/44
Abstract:
An object of the invention is to provide a molding with suppressed coloring which has good weather resistance and in which the advantageous effect does not decrease with time. The present invention provides a molding material comprising a polymer (A) obtained by polymerizing 0.01 to 35 mol % of monomer (a1) represented by a specified formula (1) and 65 to 99.99 mol % of monomer (a2) whose main component is methylmethacrylate.
Public/Granted literature
- US20140100345A1 MOLDING MATERIAL AND MOLDING Public/Granted day:2014-04-10
Information query
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