Invention Grant
- Patent Title: Silver-plated product and method for producing same
- Patent Title (中): 镀银产品及其制造方法
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Application No.: US14430653Application Date: 2013-09-17
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Publication No.: US09534307B2Publication Date: 2017-01-03
- Inventor: Keisuke Shinohara , Masafumi Ogata , Hiroshi Miyazawa , Akira Sugawara
- Applicant: DOWA METALTECH CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: Dowa Metaltech Co., Ltd.
- Current Assignee: Dowa Metaltech Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Bachman & LaPointe, PC
- Priority: JP2012-214259 20120927; JP2013-053143 20130315; JP2013-182736 20130904
- International Application: PCT/JP2013/075605 WO 20130917
- International Announcement: WO2014/050772 WO 20140403
- Main IPC: B32B15/01
- IPC: B32B15/01 ; C25D3/46 ; C25D7/00 ; C25D5/50 ; H01R13/03 ; H01H1/02 ; C22C5/06 ; C22C9/00 ; C22F1/08 ; C22F1/14 ; H01H1/023 ; H01H11/04 ; H01H1/025
Abstract:
In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material or on the surface of an underlying layer formed on the base material, the surface layer of silver is formed by electroplating in a silver plating bath which contains 1 to 15 mg/L of selenium and wherein a mass ratio of silver to free cyanogen is in the range of from 0.9 to 1.8, and thereafter, an aging treatment is carried out to produce a silver-plated product wherein an area fraction in {200} orientation of the surface layer is 15% or more.
Public/Granted literature
- US20150259815A1 SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME Public/Granted day:2015-09-17
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