Invention Grant
- Patent Title: Overmolded vane platform
- Patent Title (中): 包覆成型叶片平台
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Application No.: US13715199Application Date: 2012-12-14
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Publication No.: US09534498B2Publication Date: 2017-01-03
- Inventor: David R. Lyders
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: O'Shea Getz P.C.
- Main IPC: F01D5/14
- IPC: F01D5/14 ; F01D5/28 ; F01D9/04
Abstract:
A vane includes a platform with a fixture overmolded by a sheath.
Public/Granted literature
- US20140169956A1 OVERMOLDED VANE PLATFORM Public/Granted day:2014-06-19
Information query
