Invention Grant
- Patent Title: Light-emitting diode assembly and fabrication method thereof
- Patent Title (中): 发光二极管组件及其制造方法
-
Application No.: US14506364Application Date: 2014-10-03
-
Publication No.: US09534747B2Publication Date: 2017-01-03
- Inventor: Tzu-Chi Cheng
- Applicant: HUGA OPTOTECH INC. , Interlight Optotech Corporation
- Applicant Address: TW Taichung TW Yangmei, Taoyuan County
- Assignee: Huga Optotech Inc.,Interlight Optotech Corporation
- Current Assignee: Huga Optotech Inc.,Interlight Optotech Corporation
- Current Assignee Address: TW Taichung TW Yangmei, Taoyuan County
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW102136175A 20131007
- Main IPC: F21K9/90
- IPC: F21K9/90 ; F21K99/00 ; H01L25/075 ; H01L23/00
Abstract:
Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier.
Public/Granted literature
- US20150099320A1 LIGHT-EMITTING DIODE ASSEMBLY AND FABRICATION METHOD THEREOF Public/Granted day:2015-04-09
Information query
