Invention Grant
- Patent Title: Probe head, probe card assembly using the same, and manufacturing method thereof
- Patent Title (中): 探针头，使用其的探针卡组件及其制造方法
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Application No.: US14658572Application Date: 2015-03-16
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Publication No.: US09535091B2Publication Date: 2017-01-03
- Inventor: Ming-Cheng Hsu , Wen-Feng Liao , Wen-Tsai Su , Yuan-Pin Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R3/00 ; G01R31/26
Abstract:
A probe head includes a first substrate, a second substrate, a spacer, at least one probe, and an insulating material. The first substrate has at least one first through hole. The second substrate has at least one second through hole. The spacer is disposed between the first substrate and the second substrate. The spacer, the first substrate, and the second substrate together form a cavity. The probe is disposed in the cavity and protrudes from the first through hole and the second through hole. The insulating material is on the probe and at least partially disposed in the first through hole.
Public/Granted literature
- US20160274147A1 PROBE HEAD, PROBE CARD ASSEMBLY USING THE SAME, AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-09-22
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