Invention Grant
- Patent Title: Guide plate for a probe card and probe card provided with same
- Patent Title (中): 用于探针卡和探针卡的导板与其配套
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Application No.: US14417760Application Date: 2013-07-25
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Publication No.: US09535096B2Publication Date: 2017-01-03
- Inventor: Teppei Kimura , Liwen Fan
- Applicant: Japan Electronic Materials Corporation
- Applicant Address: JP Amagasaki-shi, Hyogo
- Assignee: Japan Electronic Materials Corporation
- Current Assignee: Japan Electronic Materials Corporation
- Current Assignee Address: JP Amagasaki-shi, Hyogo
- Agency: Kilyk & Bowersox, P.L.L.C.
- Priority: JP2012-170786 20120801
- International Application: PCT/JP2013/070212 WO 20130725
- International Announcement: WO2014/021194 WO 20140206
- Main IPC: G01R3/00
- IPC: G01R3/00 ; G01R1/073 ; G01R1/18 ; C25D5/02 ; C25D5/48 ; G01R31/28

Abstract:
It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
Public/Granted literature
- US20150301083A1 GUIDE PLATE FOR A PROBE CARD AND PROBE CARD PROVIDED WITH SAME Public/Granted day:2015-10-22
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