A liquid crystal panel motherboard need slicing is proposed. The liquid crystal panel motherboard includes a main substrate disposed at one side of a CF (2) and a main substrate disposed at one side of a TFT (1). The liquid crystal panel motherboard can be sliced to be at least two liquid crystal panels including a CF substrate (20) and a TFT substrate (10). Metallic terminal parts are formed on each TFT substrate (10). A soft protective film (24) is disposed on a touching area (22) connected to each metallic terminal part of the TFT substrate (10) connected to the CF substrate (20). The soft protective film (24) has a certain thickness and leans against its corresponding metallic terminal part on a main substrate at the side of the TFT (1). A manufacturing method of the liquid crystal panel motherboard needing slicing is also proposed. The present invention has an advantage of preventing the metallic terminal part of the TFT substrate from being scraped when the liquid crystal panel motherboard is sliced, thereby improving the production yield rate.