Invention Grant
- Patent Title: Automatic device parameter binding method and system
- Patent Title (中): 自动设备参数绑定方法和系统
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Application No.: US12895486Application Date: 2010-09-30
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Publication No.: US09535413B2Publication Date: 2017-01-03
- Inventor: Harsh Shah , David W. Siegler , James Edward Joe , Qing Jia , Tao Song , Zhen Wei
- Applicant: Harsh Shah , David W. Siegler , James Edward Joe , Qing Jia , Tao Song , Zhen Wei
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Fletcher Yoder P.C.
- Main IPC: G05B15/02
- IPC: G05B15/02 ; G05B19/042 ; G06F9/44 ; H02J9/00

Abstract:
The present invention provides techniques for automatically binding device parameters to an input and output interface. Doing so enables dynamic parameters to be available to the core firmware engine. More specifically, there is no input and output data in the configuration software domain required for mapping the parameters. Rather, the configuration software may directly access the device parameters during the logic execution. This is achieved in a library by representing the parameter repository and the EPATH pointing to each parameter from the configuration software domain.
Public/Granted literature
- US20110202145A1 AUTOMATIC DEVICE PARAMETER BINDING METHOD AND SYSTEM Public/Granted day:2011-08-18
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