Invention Grant
- Patent Title: Electronic assembly
- Patent Title (中): 电子组装
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Application No.: US14798476Application Date: 2015-07-14
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Publication No.: US09535466B2Publication Date: 2017-01-03
- Inventor: Yi-Mu Chang , Yan-Lin Kuo , Cheng-Nan Ling , Chun-I Chen , Hsien-Wei Chen , Yu-Shih Wang , Chen-Chih Hou
- Applicant: Acer Incorporated
- Applicant Address: TW New Taipei
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW New Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW104107592A 20150310
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
An electronic assembly including a first body having at least one recess, a first electronic module disposed within the first body, at least one first terminal set disposed within the recess and electrically connected to the first electronic module, a second body having at least one protruding portion, a second electronic module disposed within the second body and at least one second terminal set disposed in the protruding portion, partially exposed by the surface of the protruding portion and electrically connected to the second electronic module. The first and the second bodies are assembled to each other by the protruding portion inserting into the recess, and the first terminal set contacts the second terminal set, such that the first and the second electronic modules are electrically connected to each other through the first and the second terminal sets.
Public/Granted literature
- US20160266616A1 ELECTRONIC ASSEMBLY Public/Granted day:2016-09-15
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