An apparatus includes a device programmer, coupled to a plurality of semiconductor fuses disposed on a die, configured to program the plurality of semiconductor fuses with compressed configuration data for a plurality of cores disposed separately on the die. The device programmer has a virtual fuse array and a compressor. The virtual fuse array is configured to store the configuration data for the plurality of cores. The configuration data includes a plurality of data types. The compressor is coupled to the virtual fuse array and is configured to read the virtual fuse array, and is configured to compress the configuration data by employing a plurality of compression algorithms to generate the compressed configuration data, where the plurality of compression algorithms correspond to the plurality of data types.