Invention Grant
- Patent Title: In-hierarchy circuit analysis and modification
- Patent Title (中): 分级电路分析和修改
-
Application No.: US14313875Application Date: 2014-06-24
-
Publication No.: US09536036B1Publication Date: 2017-01-03
- Inventor: Ping-San Tzeng
- Applicant: Atoptech, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Atoptech, Inc.
- Current Assignee: Atoptech, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Van Pelt, Yi & James LLP
- Main IPC: G06F9/455
- IPC: G06F9/455 ; G06F17/50

Abstract:
Performing RC analysis in a hierarchical circuit design includes: accessing hierarchical circuit data in the hierarchical circuit design, the hierarchical circuit data comprising top-level data and lower-level block data; obtaining hierarchical RC information; combining RC information on boundary paths between blocks and RC information on boundary paths within blocks to generate boundary RC information; performing RC analysis using the boundary RC information to determine a timing delay; and comparing the timing delay with a desired delay to determine whether an RC timing is closed.
Information query