Invention Grant
- Patent Title: Gaming chip having capacitive coupling and related methods
- Patent Title (中): 具有电容耦合和相关方法的游戏芯片
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Application No.: US14499018Application Date: 2014-09-26
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Publication No.: US09536388B2Publication Date: 2017-01-03
- Inventor: Karthik Shenoy Panambur , Yogendrasinh Hematji Rajput , Prateek Kumar Baishkhiyar , Ravi Subramanian
- Applicant: Bally Gaming, Inc.
- Applicant Address: US NV Las Vegas
- Assignee: BALLY GAMING, INC.
- Current Assignee: BALLY GAMING, INC.
- Current Assignee Address: US NV Las Vegas
- Agency: Seed IP Law Group LLP
- Main IPC: G06F17/00
- IPC: G06F17/00 ; G06F19/00 ; G07F17/32 ; G06K19/04

Abstract:
A system is disclosed for identifying and reading gaming tokens. The system includes: a plurality of gaming tokens; a playing surface including a network of conductors disposed to make electrical contact with the conductive rims of the gaming tokens; one or more transceivers disposed under the playing surface and associated with areas where the gaming tokens are placed on the playing surface; and an identification processor in communication with the transceiver to determine the denomination of the token from the data. Each transceiver is configured to transmit an electromagnetic interrogation signal to the conductive layer of a gaming token resting on the playing surface. The grounded circuit, in response to the interrogation signal, responds with data to identify the chip denomination through capacitive coupling between the conductive layer and a transceiver.
Public/Granted literature
- US20160093165A1 GAMING CHIP HAVING CAPACITIVE COUPLING AND RELATED METHODS Public/Granted day:2016-03-31
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