Invention Grant
- Patent Title: Data reception chip
- Patent Title (中): 数据接收芯片
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Application No.: US14969350Application Date: 2015-12-15
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Publication No.: US09536594B1Publication Date: 2017-01-03
- Inventor: Hongquan Sun
- Applicant: VIA Alliance Semiconductor Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: VIA ALLIANCE SEMICONDUCTOR CO., LTD.
- Current Assignee: VIA ALLIANCE SEMICONDUCTOR CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: McClure, Qualey & Rodack, LLP
- Priority: CN201510843471 20151126
- Main IPC: G11C7/06
- IPC: G11C7/06 ; G11C11/4099 ; G11C11/4093

Abstract:
A data reception chip coupled to an external memory including a first input-output pin to output first data and including a comparison module, a voltage generation module, a logic unit, a detection module and a switching module is provided. The comparison module is coupled to the first input-output pin to configure to receive the first data. The comparison module compares the first data with a first reference voltage to identify the value of the first data. The voltage generation module is configured to generate the first reference voltage. The logic unit is coupled to the comparison module and the voltage generation module and outputs at least one switching signal. The detection module detects the logic unit to generate at least one detection signal. The switching module transmits the detection signal to a test pin according to the switching signal.
Public/Granted literature
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