A memory module is provided. In one example, the memory module includes a printed circuit board with one or more connectors, and a plurality of multi-chip packaged integrated circuit parts mounted to the printed circuit board. Each of the plurality of multi-chip packaged integrated circuit parts includes an integrated circuit package including a slave memory controller (SMC) die and one or more pairs of (1) a spacer under the slave memory controller die and (2) a flash memory die under the spacer. Each flash memory die is larger than each spacer to provide an opening into a perimeter of the flash memory die to which electrical connections may be made.