Invention Grant
- Patent Title: Wire harness
- Patent Title (中): 线束
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Application No.: US15015895Application Date: 2016-02-04
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Publication No.: US09536639B2Publication Date: 2017-01-03
- Inventor: Morichika Yamamoto , Masataka Wakabayashi
- Applicant: Sumitomo Wiring Systems, Ltd
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Dinsmore & Shohl LLP
- Priority: JP2015-027664 20150216
- Main IPC: H01B7/282
- IPC: H01B7/282 ; H01B7/00 ; B60R16/02 ; H01B7/02

Abstract:
A wire harness is provided in which, by merely overlap wrapping a binding tape member around a group of lead wires, intruding water can be guided to the outside. The wire harness includes a group of lead wires and a binding tape-type protection portion that covers the group of lead wires. The binding tape-type protection portion is formed by overlap wrapping a binding tape member around the group of lead wires, the binding tape member having a tape member body made of a synthetic resin and an adhesive layer formed on one surface of the tape member body. The tape member body has a plurality of water drain holes that are provided so as to penetrate the wall of the tape member body in the width direction, and that are provided in the lengthwise direction.
Public/Granted literature
- US20160240282A1 WIRE HARNESS Public/Granted day:2016-08-18
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