Invention Grant
- Patent Title: Device manufacturing cleaning process using vaporized solvent
- Patent Title (中): 使用蒸发溶剂的装置制造清洗工艺
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Application No.: US14020526Application Date: 2013-09-06
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Publication No.: US09536757B2Publication Date: 2017-01-03
- Inventor: Albert Po Chia Chen , Kuo-Sheng Chuang , Chi-Ming Yang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: B08B5/00
- IPC: B08B5/00 ; H01L21/67 ; H01L21/02 ; B08B3/04

Abstract:
A cleaning method using vaporized solvent is provided. A solvent-containing vapor is generated, wherein the solvent-containing vapor comprises a solvent. The solvent-containing vapor is conducted to a substrate having debris or contaminants to clean the substrate, wherein the solvent-containing vapor condenses to form a liquid on a surface of the substrate. The liquid phase of the solvent-containing vapor is changed to a solid phase. The solid phase of the solvent-containing vapor is changed back to a liquid phase. The substrate is spun dried to remove the solvent-containing vapor in liquid phase and any debris or contaminants.
Public/Granted literature
- US20150068559A1 Device Manufacturing Cleaning Process Using Vaporized Solvent Public/Granted day:2015-03-12
Information query
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