Invention Grant
- Patent Title: Fin structure of semiconductor device
- Patent Title (中): 半导体器件的鳍结构
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Application No.: US14793567Application Date: 2015-07-07
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Publication No.: US09536772B2Publication Date: 2017-01-03
- Inventor: Chung-Hsien Chen , Tung Ying Lee , Yu-Lien Huang , Chi-Wen Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L21/324 ; H01L21/762 ; H01L29/78 ; H01L21/02 ; H01L29/06 ; H01L29/66 ; H01L21/306

Abstract:
The disclosure relates to a fin structure of a semiconductor device. An exemplary fin structure for a semiconductor device comprises a lower portion protruding from a major surface of a substrate, wherein the lower portion comprises a first semiconductor material having a first lattice constant; an upper portion having an interface with the lower portion, wherein the upper portion comprises a second semiconductor material having a second lattice constant different from the first lattice constant; a first pair of notches lower than the interface and extending into opposite sides of the lower portion, wherein each first notch have a first width; and a second pair of notches extending into opposite sides of the interface, wherein each second notch have a second width greater than the first width.
Public/Granted literature
- US20150311111A1 Fin Structure of Semiconductor Device Public/Granted day:2015-10-29
Information query
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