Invention Grant
- Patent Title: Fin-double-gated junction field effect transistor
- Patent Title (中): 翅片双栅结场效应晶体管
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Application No.: US15007616Application Date: 2016-01-27
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Publication No.: US09536789B1Publication Date: 2017-01-03
- Inventor: Kangguo Cheng , Tak H. Ning
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MASHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MASHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8232 ; H01L27/098 ; H01L29/66 ; H01L29/40 ; H01L29/16

Abstract:
A method of forming a double-gated junction field effect transistors (JFET) and a tri-gated metal-oxide-semiconductor field effect transistor (MOSFET) on a common substrate is provided. The double-gated JFET is formed in a first region of a substrate by forming a semiconductor gate electrode contacting sidewall surfaces of a first channel region of a first semiconductor fin and a top surface of a portion of a first fin cap atop the first channel region. The tri-gated MOSFET is formed in a second region of the substrate by forming a metal gate stack contacting a top surface and sidewall surfaces of a second channel region of a second semiconductor fin.
Information query
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