Invention Grant
US09536794B2 Techniques for dual dielectric thickness for a nanowire CMOS technology using oxygen growth
有权
用于使用氧气生长的纳米线CMOS技术的双电介质厚度的技术
- Patent Title: Techniques for dual dielectric thickness for a nanowire CMOS technology using oxygen growth
- Patent Title (中): 用于使用氧气生长的纳米线CMOS技术的双电介质厚度的技术
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Application No.: US14671041Application Date: 2015-03-27
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Publication No.: US09536794B2Publication Date: 2017-01-03
- Inventor: Josephine B. Chang , Michael A. Guillorn , Isaac Lauer , Jeffrey W. Sleight
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Louis J. Percello
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/84 ; H01L21/8238 ; H01L27/092 ; H01L29/423

Abstract:
In one aspect, a method of forming a CMOS device includes forming nanowires suspended over a BOX, wherein a first/second one or more of the nanowires are suspended at a first/second suspension height over the BOX, and wherein the first suspension height is greater than the second suspension height; depositing a conformal gate dielectric on the BOX and around the nanowires wherein the conformal gate dielectric deposited on the BOX is i) in a non-contact position with the conformal gate dielectric deposited around the first one or more of the nanowires, and ii) is in direct physical contact with the conformal gate dielectric deposited around the second one or more of the nanowires such that the BOX serves as an oxygen source during growth of a conformal oxide layer at the interface between the conformal gate dielectric and the second one or more of the nanowires.
Public/Granted literature
- US20160284604A1 Techniques for Dual Dielectric Thickness for a Nanowire CMOS Technology Using Oxygen Growth Public/Granted day:2016-09-29
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