Invention Grant
- Patent Title: Substrate treatment apparatus and substrate treatment method
- Patent Title (中): 基板处理装置及基板处理方法
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Application No.: US14614834Application Date: 2015-02-05
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Publication No.: US09536797B2Publication Date: 2017-01-03
- Inventor: Junichi Igarashi , Katsuhiro Sato , Keiko Morita , Hideaki Hirabayashi
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-148780 20140722
- Main IPC: F26B5/04
- IPC: F26B5/04 ; H01L21/66

Abstract:
A substrate treatment apparatus includes a processing chamber configured to be capable of storing a substrate; a substrate holder disposed in the processing chamber and configured to be capable of holding the substrate; a sublimation removing unit configured to remove, by sublimation, a sublimating material filled between structures formed on a surface of a substrate held by the substrate holder, and a sublimation status detecting unit configured to detect a progress or an end point of sublimation removal of the sublimating material.
Public/Granted literature
- US20160025410A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD Public/Granted day:2016-01-28
Information query
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