Invention Grant
- Patent Title: Method of manufacturing heat conductive sheet
- Patent Title (中): 导热片的制造方法
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Application No.: US14899221Application Date: 2014-06-27
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Publication No.: US09536804B2Publication Date: 2017-01-03
- Inventor: Keisuke Aramaki , Atsuya Yoshinari , Takuhiro Ishii , Shinichi Uchida , Masahiko Ito
- Applicant: Dexerials Corporation
- Applicant Address: JP Shinagawa-ku, Tokyo
- Assignee: Dexerials Corporation
- Current Assignee: Dexerials Corporation
- Current Assignee Address: JP Shinagawa-ku, Tokyo
- Agency: KENJA IP LAW PC
- Priority: JP2013-138461 20130701; JP2014-123047 20140616
- International Application: PCT/JP2014/067152 WO 20140627
- International Announcement: WO2015/002085 WO 20150108
- Main IPC: F28F13/18
- IPC: F28F13/18 ; H01L23/373 ; F28F21/02 ; H01L21/48 ; H01L23/367

Abstract:
Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body (7) with an uncured component (8) of the binder resin oozing from the sheet main body (7).
Public/Granted literature
- US20160141223A1 Method of Manufacturing Heat Conductive Sheet, Heat Conductive Sheet, and Heat Dissipation Member Public/Granted day:2016-05-19
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