The invention relates to a micro cooling element (1) with a mounting surface (2) for a component to be cooled, in particular a semiconductor component, which has within it a micro cooling structure (3) which is connected by connection channels (4) to at least one inflow opening (4a) and at least one outflow opening (4b) by means of which a cooling medium can be supplied to the micro cooling structure (3) or be discharged from the latter, and which is characterized in that it is formed from at least two different powdery and/or liquid, in particular metallic and/or ceramic, materials or material mixtures (10) while maintaining a monolithic structure, wherein regions of different stresses (I, II) of the micro cooling element (1) are built by a powdery and/or liquid, in particular metallic and/or ceramic materials or material mixtures (10) being adapted to the stress respectively.The invention further relates to an apparatus and a process for producing a micro cooling element according to the invention.