Invention Grant
- Patent Title: Electronic devices and methods of manufacturing electronic devices
- Patent Title (中): 电子设备和制造电子设备的方法
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Application No.: US14978593Application Date: 2015-12-22
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Publication No.: US09536817B2Publication Date: 2017-01-03
- Inventor: Jae-Sung Lim , Hyung-Jun Kim
- Applicant: HANA MICRON INC.
- Applicant Address: KR Asan-si
- Assignee: HANA MICRON INC.
- Current Assignee: HANA MICRON INC.
- Current Assignee Address: KR Asan-si
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Priority: KR10-2014-0194962 20141231
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/498 ; H01L23/29 ; H01L23/31 ; H01L21/78 ; H01L21/56 ; H01L23/00 ; H01L21/683 ; H01L23/36
Abstract:
Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible chip, a protection film and a flexible substrate. The flexible chip may include a first wiring on a first face thereof. The flexible chip may have a foldable and spreadable structure by reducing a thickness from a second face thereof. The protection film may be disposed on the second face of the flexible chip for protecting the flexible chip. The flexible substrate may include a second wiring on one face thereof. The protection film on disposed on the second face of the flexible chip may make contact with the flexible substrate. The first wiring of the flexible chip may be electrically connected to the second wiring of the flexible substrate using a wire.
Public/Granted literature
- US20160190043A1 Electronic Devices and Methods of Manufacturing Electronic Devices Public/Granted day:2016-06-30
Information query
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