Invention Grant
- Patent Title: Drawn dummy FeCAP, via and metal structures
- Patent Title (中): 绘制虚拟FeCAP，通孔和金属结构
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Application No.: US12576340Application Date: 2009-10-09
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Publication No.: US09536822B2Publication Date: 2017-01-03
- Inventor: Scott R. Summerfelt , Rajni J. Aggarwal
- Applicant: Scott R. Summerfelt , Rajni J. Aggarwal
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/00 ; H01L23/522 ; H01L23/58 ; H01L27/02 ; H01L49/02 ; H01L27/115
Abstract:
An integrated circuit containing hydrogen permeable dummy vias configured in a linear or rectangular array and symmetrically positioned over a component in the integrated circuit. An integrated circuit containing matching components with identical layouts and hydrogen permeable dummy vias in identical configurations over the matching components. A process of forming an integrated circuit containing matching components with identical layouts and hydrogen permeable dummy vias in identical configurations over the matching components.
Public/Granted literature
- US20100090340A1 Drawn Dummy FeCAP, Via and Metal Structures Public/Granted day:2010-04-15
Information query
IPC分类:
