Invention Grant
- Patent Title: Semiconductor package with conformal EM shielding structure and manufacturing method of same
- Patent Title (中): 具有适形EM屏蔽结构的半导体封装及其制造方法
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Application No.: US14814525Application Date: 2015-07-31
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Publication No.: US09536841B2Publication Date: 2017-01-03
- Inventor: Ming-Che Wu
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD.
- Current Assignee: CYNTEC CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/06 ; H01L23/48 ; H01L23/552 ; H01L21/78 ; H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor package includes a substrate having a front side, a bottom side, and a sidewall along a perimeter of the substrate, a plurality of solder pads on the bottom side, at least one EM shielding contact structure on the bottom side and partially exposed on the sidewall, a semiconductor device mounted on the front side, a mold compound on the front side and covering the semiconductor device, and an EM shielding layer conformally covering the mold compound and the sidewall. The EM shielding layer is in direct contact with the exposed portion of the EM shielding contact structure on the sidewall.
Public/Granted literature
- US20160035680A1 SEMICONDUCTOR PACKAGE WITH CONFORMAL EM SHIELDING STRUCTURE AND MANUFACTURING METHOD OF SAME Public/Granted day:2016-02-04
Information query
IPC分类:
