Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14833983Application Date: 2015-08-24
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Publication No.: US09536946B2Publication Date: 2017-01-03
- Inventor: Jae-Ho Park , Taejoong Song , Sanghoon Baek , Jintae Kim , Giyoung Yang , Hyosig Won
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2015-0013578 20150128
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/08 ; H01L29/417 ; H01L27/02 ; H01L27/092 ; H01L21/8238

Abstract:
A semiconductor device includes a substrate having an active region, a gate structure intersecting the active region and extending in a first direction parallel to a top surface of the substrate, a first source/drain region and a second source/drain region disposed in the active region at both sides of the gate structure, respectively, and a first modified contact and a second modified contact in contact with the first source/drain region and the second source/drain region, respectively. The distance between the gate structure and the first modified contact is smaller than the distance between the gate structure and the second modified contact.
Public/Granted literature
- US20160056155A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-02-25
Information query
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