Invention Grant
- Patent Title: Semiconductor device, method of manufacturing the same, and power module
- Patent Title (中): 半导体装置及其制造方法以及电源模块
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Application No.: US15086153Application Date: 2016-03-31
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Publication No.: US09536948B2Publication Date: 2017-01-03
- Inventor: Toshio Nakajima
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2010-292107 20101228
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/32 ; H01L29/66 ; H01L29/78 ; H01L21/265 ; H02M7/5387 ; H02P6/14 ; H01L21/324 ; H01L27/088 ; H02P27/06 ; H01L21/263

Abstract:
A semiconductor device includes an n-type drain layer, an n-type base layer provided on the n-type drain layer, a p-type base layer and an n-type source layer partially formed in surface layer portions of the n-type base layer and the p-type base layer, respectively, a gate insulation film formed on a surface of the p-type base layer between the n-type source layer and the n-type base layer, a gate electrode formed on the gate insulation film facing the p-type base layer across the gate insulation film, a p-type column layer formed within the n-type base layer to extend from the p-type base layer toward the n-type drain layer, a depletion layer alleviation region arranged between the p-type column layer and the n-type drain layer and including first baryons converted to donors, a source electrode connected to the n-type source layer, and a drain electrode connected to the n-type drain layer.
Public/Granted literature
- US20160211323A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER MODULE Public/Granted day:2016-07-21
Information query
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