Invention Grant
US09537058B2 Embedded white light LED package structure based on solid-state fluorescence material and manufacturing method thereof 有权
基于固态荧光材料的嵌入式白光LED封装结构及其制造方法

Embedded white light LED package structure based on solid-state fluorescence material and manufacturing method thereof
Abstract:
The present invention discloses an embedded white light LED package structure based on a solid-state fluorescence material. In the present invention, the high power blue light chip is directly embedded into and bonded with a groove of the solid-state fluorescence material, and blue light emitted by the chip and yellow and green light obtained by conversion and emitted by the solid-state fluorescence material are blended by using the principle of lenses, to obtain white light. The embedded white light LED package structure based on a solid-state fluorescence material has a simple process, low cost, and high fluorescence efficiency; and blue light does not leak. Heat dissipation can be directly performed by using the solid-state fluorescence material, and heat dissipation performance is desirable. Energy conservation and environmental protection is achieved, and a service life of an LED lighting device is greatly improved.
Information query
Patent Agency Ranking
0/0