Invention Grant
- Patent Title: Embedded white light LED package structure based on solid-state fluorescence material and manufacturing method thereof
- Patent Title (中): 基于固态荧光材料的嵌入式白光LED封装结构及其制造方法
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Application No.: US14761954Application Date: 2014-06-05
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Publication No.: US09537058B2Publication Date: 2017-01-03
- Inventor: Yueshan Liang , Dunhua Cao , Kejun Ma
- Applicant: SHANGHAI FUDI LIGHTING ELECTRONIC CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI FUDI LIGHTING ELECTRONIC CO., LTD.
- Current Assignee: SHANGHAI FUDI LIGHTING ELECTRONIC CO., LTD.
- Current Assignee Address: CN Shanghai
- International Application: PCT/CN2014/079253 WO 20140605
- International Announcement: WO2015/184618 WO 20151210
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L33/50 ; H01L33/32 ; H01L33/60 ; H01L33/64

Abstract:
The present invention discloses an embedded white light LED package structure based on a solid-state fluorescence material. In the present invention, the high power blue light chip is directly embedded into and bonded with a groove of the solid-state fluorescence material, and blue light emitted by the chip and yellow and green light obtained by conversion and emitted by the solid-state fluorescence material are blended by using the principle of lenses, to obtain white light. The embedded white light LED package structure based on a solid-state fluorescence material has a simple process, low cost, and high fluorescence efficiency; and blue light does not leak. Heat dissipation can be directly performed by using the solid-state fluorescence material, and heat dissipation performance is desirable. Energy conservation and environmental protection is achieved, and a service life of an LED lighting device is greatly improved.
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