Invention Grant
- Patent Title: Method of manufacturing semiconductor light emitting device, and semiconductor light emitting device
- Patent Title (中): 制造半导体发光器件的方法和半导体发光器件
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Application No.: US14909359Application Date: 2014-07-30
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Publication No.: US09537066B2Publication Date: 2017-01-03
- Inventor: Yoshitaka Kadowaki
- Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-158167 20130730
- International Application: PCT/JP2014/070026 WO 20140730
- International Announcement: WO2015/016246 WO 20150205
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/58 ; H01L33/22 ; H01L33/20

Abstract:
When an uneven pattern is formed on a light extraction surface composed of a semiconductor crystal by wet-etching using an alkaline solution, a plurality of convex portions cannot be formed in a desired arrangement. A method of manufacturing a semiconductor light emitting device includes a light extraction surface composed of a semiconductor crystal, wherein when the uneven pattern is formed by a plurality of convex portions on the light extraction surface, first, a plurality of impressions are formed on the light extraction surface of a semiconductor layer composed of a semiconductor crystal using a processing substrate, and next, by applying wet-etching to the light extraction surface using an alkaline solution, to thereby form convex portions with a portion where each impression is formed as a top portion, and a plurality of facets of the semiconductor crystal as a side face thereof.
Public/Granted literature
- US20160197251A1 METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE, AND SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2016-07-07
Information query
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