Invention Grant
US09537071B2 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
有权
发光元件，树脂封装，树脂成形体，以及制造发光元件，树脂封装和树脂成形体的方法
- Patent Title: Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
- Patent Title (中): 发光元件，树脂封装，树脂成形体，以及制造发光元件，树脂封装和树脂成形体的方法
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Application No.: US14928550Application Date: 2015-10-30
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Publication No.: US09537071B2Publication Date: 2017-01-03
- Inventor: Hirofumi Ichikawa , Masaki Hayashi , Shimpei Sasaoka , Tomohide Miki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2008-225408 20080903
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/62 ; H01L33/48 ; B29C45/00 ; B29C45/14 ; H01L23/00 ; H01L33/64
Abstract:
A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.
Public/Granted literature
Information query
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