Invention Grant
- Patent Title: Three dimensional logic circuit
- Patent Title (中): 三维逻辑电路
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Application No.: US14617885Application Date: 2015-02-09
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Publication No.: US09537471B2Publication Date: 2017-01-03
- Inventor: Pratyush Kamal
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H03K3/356
- IPC: H03K3/356 ; H03K3/012 ; H03K3/3562 ; G11C19/28 ; H01L27/06 ; G11C19/34

Abstract:
A 3D multi-bit flip-flop may include a two tier structure. The two tier structure may include a first tier containing a common clock circuit for the multi-bit flip-flop as well as the clock driven portions of the individual flip-flops and a second tier containing a common scan circuit for the multi-bit flip-flop as well as the non-clock driven portions of the individual flip-flops. Alternatively, the first tier may include the common clock circuit as well as a portion of the individual flip-flops and the second tier may include the common scan circuit as well as the other portion of the individual flip-flops.
Public/Granted literature
- US20160233853A1 THREE DIMENSIONAL LOGIC CIRCUIT Public/Granted day:2016-08-11
Information query
IPC分类: