Invention Grant
- Patent Title: Method and apparatus for microwave treatment of dielectric films
- Patent Title (中): 电介质膜微波处理方法和装置
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Application No.: US14120010Application Date: 2014-04-15
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Publication No.: US09538586B2Publication Date: 2017-01-03
- Inventor: Iftikhar Ahmad
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H05B6/80 ; H01L21/268 ; H01L21/67
Abstract:
An apparatus for thermal treatment of dielectric films on substrates comprises: a microwave applicator cavity and microwave power source; a workpiece to be heated in the cavity, comprising a porous coating on a selected substrate; and, a means of introducing a controlled amount of a polar solvent into said porous coating immediately before heating by said microwave power. The interaction of the polar solvent with the microwaves enhances the efficiency of the process, to shorten process time and reduce thermal budget. A related method comprises the steps of: depositing a porous film on a substrate; soft baking the film to a selected state of dryness; introducing a controlled amount of a polar solvent into the soft baked film; and, applying microwave energy to heat the film via interaction with the polar solvent.
Public/Granted literature
- US20140322922A1 Method and apparatus for microwave treatment of dielectric films Public/Granted day:2014-10-30
Information query
IPC分类:
