Invention Grant
- Patent Title: Encapsulation of light-emitting elements on a display module
- Patent Title (中): 将发光元件封装在显示模块上
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Application No.: US14861403Application Date: 2015-09-22
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Publication No.: US09538588B2Publication Date: 2017-01-03
- Inventor: Shannon Lee Mutschelknaus , Jordan Gab , Nathan Lane Nearman , Ryan J. Nielsen
- Applicant: Daktronics, Inc.
- Applicant Address: US SD Brookings
- Assignee: Daktronics, Inc.
- Current Assignee: Daktronics, Inc.
- Current Assignee Address: US SD Brookings
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04N9/30
- IPC: H04N9/30 ; H05B33/00 ; H05B33/04 ; G09F27/00 ; G09F9/302 ; G09F9/33 ; F21V19/00 ; F21V23/00 ; F21Y105/00
Abstract:
A video display module comprises a circuit board having a front face, a plurality of light-emitting elements electrically coupled to the front face of the circuit board, and a polymer encapsulating member adhered to the front face of the circuit board, the polymer encapsulating member substantially covering at least a portion of the circuit board and a portion of the plurality of light-emitting elements, the polymer encapsulating member substantially sealing the portion of the circuit board and the portion of the plurality of light-emitting elements.
Public/Granted literature
- US20160014854A1 ENCAPSULATION OF LIGHT-EMITTING ELEMENTS ON A DISPLAY MODULE Public/Granted day:2016-01-14
Information query
